Orchard House, Orchard Close, Severn Stoke, Worcester, UK WR8 9JJ
Telephone: 44 (0) 1905 371460 *** Fax: 44 (0) 1905 371477
E-Mail: sales@advanced-ndt.co.uk *** Website: www.advanced-ndt.co.uk
A range of Ultrasonic Bond Testing Gauges currently available from Advanced NDT Ltd Suppliers of Optimum NDT Solutions at cost effective Prices.
Introducing... The All New BondaScope Series Ultrasonic Bond Testers
...
BondaScope 3100
...
BondaScope 350
...
BondaScope 300
Three NEW BondaScope Series, Ultrasonic Bond Testers are available to meet simple to complex applications and fit virtually any budget. ALL units offer a tremendous mix of High Speed Performance, Features and Value.
Highlights of each model are outlined below:
BondaScope 300: Is a simple to operate Ultrasonic Bond Tester incorporating a frequency adjustable Pitch-Catch mode only. It features a tunable Tone Burst as well as a high energy spike pulse for those absorbent or other difficult materials. This unit may be simple to use, but the real features lie beneath the surface. Three simple direct access keys set the desired operational mode from RF Phase Bond Profile, RF Amplitude Bond Profile and our exclusive Bond "Signature" mode. Other features include phase and/or amplitude alarm gating with a high dB audio alarm. In addition, there is a high level password protection scheme also. Display is 3.9" Diag. LCD and is FULLY SUNLIGHT readable, Quarter VGA (240x320). Size 7.25" Tall x 3.5" Wide x 1.87" Thick and 1.8lbs (with all batteries installed). The unit operates on 3 or 6 'AA' NiMH or alkaline batteries for up to 10 hours. More...
BondaScope 350: A step up from the BondaScope 300 in features as well as capability all in a ruggedized, hand held instrument (size and weight as above). In addition to the adjustable Pitch-Catch Mode, the BondaScope features an Resonance Impedance Plane mode as well as a Swept Frequency Pitch-Catch mode. Better than 70% of applications fall into the capabilities of the BondaScope 350. Other mechanical specifications as above. More...
BondaScope 3100: FINALLY, the follow on to the famed capability of the BondaScope 2100, the BondaScope 3100 Re-Defines the meaning of "Full-Featured" and "Multi-Mode" Composite Bond Tester Housed in a larger ruggedized aluminum case featuring a High Speed, 5.7" Diag. QVGA, Hi-Bright, EL Display featuring our "X-or" Digital Phosphor, true persistance control... not simply a screen clear.
In addition the BondaScope 3100 incorporates all of the features above including the Resonance Impedance Plane Mode, adding an adjustable, Hi-Energy fixed frequency Mechanical Impedance Analysis Mode (MIA) as well as a Swept Frequency MIA (SweepMI) Mode bringing the MIA mode to a more useful and interpretive purpose.
Another mode specific to the BondaScope 3100 is the High-Energy, Swept Frequency Pitch-Catch Mode. The modes above can be presented in NDT Systems exclusive Real Time, Bond Profile Mode. Dimensions of the BondaScope 3100 are 8.9" Tall x 5.75" Wide x 2.45 Deep and operates up to 9 hours on one Li-Ion Smart Battery Pack. Probes connect via an 11 pin Fischer Connector and are available from NDT Systems incorporating our Probe Recognition Technology (simplifying initial setups) or use probes of other manufacture directly, if desired potentially offering a significant savings in total cost of ownership. More...
|
BondaScope Ultrasonic Bond Tester - Features and Specifications Selector |
|||
|
Feature/Mode |
BondaScope 300 |
BondaScope 350 |
BondaScope 3100 |
|
Pitch-Catch |
Yes |
||
|
Pitch-Catch -Swept |
No |
Yes |
|
|
Resonance |
No |
Yes |
|
|
MIA |
No |
Yes |
|
|
MIA - Swept |
No |
Yes |
|
|
RF |
Yes |
||
|
Flying Dot Display |
No |
Yes |
|
|
Trace Rotation |
No |
Yes |
|
|
Signature Mode |
Yes |
||
|
Reference Display |
No |
Yes |
|
|
Bond Profile Display |
Yes |
||
|
SplitScan |
Yes |
||
|
SplitView |
Yes |
||
|
Auto-Probe Recognition |
Yes |
||
|
Probe Library |
No |
Yes - Select from industry available probes |
|
|
Frequency Range |
250Hz to 1.5MHz (Test Mode Specific) |
||
|
Gain |
0 - 66 dB |
||
|
Continuous Wave |
No |
Yes |
|
|
Tone Burst |
Yes |
||
|
High Energy Spike |
Yes |
||
|
Probe Connector |
8 Pin Lemo |
11 Pin Fischer |
|
|
Alarms: |
|
|
|
|
Amplitude |
Yes |
||
|
Phase |
Yes |
||
|
Halo (around reference) |
No |
Yes |
|
|
Square (around reference) |
No |
Yes |
|
|
Ellipse (around reference) |
No |
Yes |
|
|
BOX |
No |
Yes - Positioned Anywhere On Screen |
|
|
Display |
3.9" LCD |
5.7" Electro-Luminescent |
|
|
Backlight |
LED Backlight |
N/A |
|
|
Display Resolution |
QVGA - 240 x 320 Pixels |
||
|
Digital Persistence |
No |
Yes |
|
|
Trace Storage |
250 - Each with up to 8 lines of 30 character text |
||
|
Calibration Storage |
100 - Each with 30 character file name & 8 lines of 30 character text |
||
|
Password Protection |
Yes |
||
|
Input / Output: |
|
|
|
|
USB |
Yes |
||
|
0-5VDC |
Alarm - Pos or Neg - Latched or Momentary - Phase, Amplitude, X & Y Dot Location - Rate continuus in Resonance and MIA (MIA Out 3100 Only) - Outputs Optional on 350 |
||
|
Windows Based X-Fer Software |
Yes |
||
|
Power |
3 or 6 'AA' 6ea (NiMH Provided) |
Li-Ion Smart Cell (1ea) |
|
|
Charger |
External Wall (90 / 260 Auto Sense) |
90 / 260 Smart Charger |
|
|
Operating Time - (approx) |
Up to 8 Hours |
6-8 Hours |
|
|
Weight |
1.8lbs (0.8kg) |
5lbs (2.27kg) |
|
|
Operating Temp |
32° to 140°F (0° - 60°C) |
-10° to 140°F (-23°-60°C) |
|
|
Size |
7"H x 3.5"W x 1.87"D (178x89x48mm) |
9.25"H x 5.5"W x 2.9"D (235x140x74mm) |
|
Bond Testers
Pitch-Catch - Hand Held Bond Testing Unit - as used by the MOD / RAF for composite inspection
Pitch-Catch & Resonance - Tone burst & high energy spike pitch-catch mode & resonance in a 1.8lb hand-held package
Pitch-Catch, Resonance & MIA - Tri Mode Comprehensive Bond Tester
