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BondaScope Ultrasonic Bond Tester - Features and Specifications Selector |
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Feature/Mode |
BondaScope 300 |
BondaScope 350 |
BondaScope 3100 |
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Pitch-Catch |
Yes |
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Pitch-Catch -Swept |
No |
Yes |
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Resonance |
No |
Yes |
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MIA |
No |
Yes |
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MIA - Swept |
No |
Yes |
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RF |
Yes |
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Flying Dot Display |
No |
Yes |
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Trace Rotation |
No |
Yes |
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Signature Mode |
Yes |
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Reference Display |
No |
Yes |
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Bond Profile Display |
Yes |
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SplitScan |
Yes |
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SplitView |
Yes |
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Auto-Probe Recognition |
Yes |
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Probe Library |
No |
Yes - Select from industry available probes |
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Frequency Range |
250Hz to 1.5MHz (Test Mode Specific) |
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Gain |
0 - 66 dB |
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Continuous Wave |
No |
Yes |
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Tone Burst |
Yes |
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High Energy Spike |
Yes |
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Probe Connector |
8 Pin Lemo |
11 Pin Fischer |
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Alarms: |
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Amplitude |
Yes |
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Phase |
Yes |
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Halo (around reference) |
No |
Yes |
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Square (around reference) |
No |
Yes |
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Ellipse (around reference) |
No |
Yes |
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BOX |
No |
Yes - Positioned Anywhere On Screen |
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Display |
3.9" LCD |
5.7" Electro-Luminescent |
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Backlight |
LED Backlight |
N/A |
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Display Resolution |
QVGA - 240 x 320 Pixels |
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Digital Persistence |
No |
Yes |
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Trace Storage |
250 - Each with up to 8 lines of 30 character text |
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Calibration Storage |
100 - Each with 30 character file name & 8 lines of 30 character text |
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Password Protection |
Yes |
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Input / Output: |
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USB |
Yes |
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0-5VDC |
Alarm - Pos or Neg - Latched or Momentary - Phase, Amplitude, X & Y Dot Location - Rate continuus in Resonance and MIA (MIA Out 3100 Only) - Outputs Optional on 350 |
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Windows Based X-Fer Software |
Yes |
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Power |
3 or 6 'AA' 6ea (NiMH Provided) |
Li-Ion Smart Cell (1ea) |
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Charger |
External Wall (90 / 260 Auto Sense) |
90 / 260 Smart Charger |
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Operating Time - (approx) |
Up to 8 Hours |
6-8 Hours |
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Weight |
1.8lbs (0.8kg) |
5lbs (2.27kg) |
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Operating Temp |
32° to 140°F (0° - 60°C) |
-10° to 140°F (-23°-60°C) |
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Size |
7"H x 3.5"W x 1.87"D (178x89x48mm) |
9.25"H x 5.5"W x 2.9"D (235x140x74mm) |
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A range of Ultrasonic Bond Testing Gauges currently available from Advanced NDT Ltd - suppliers of Optimum NDT Solutions at cost effective Prices.
...
BondaScope 3100 - Multi-Mode Ultrasonic Bond Tester - Resonance, Pitch-Catch & Mechanical Impedance Analysis Mode - MIA
... BondaScope 350 - Resonance and Pitch-Catch (Tone Burst and High Energy Spike) in a 1.8lb handheld Package
... BondaScope 300 - Pitch-Catch Mode; Tone Burst & High Energy Spike incorporating our exclusive "Signature" Mode.